EN 61760-1 ed. 2This description is for standard: EN 61760-1 ed. 2Gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electron
EN 62421This description is for standard: EN 62421Provides a generic standard of electronic modules on which their sectional standards are based. Also provides a definition, business model, interface
EN 62137-1-1This description is for standard: EN 62137-1-1The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test an
EN 62137-1-2This description is for standard: EN 62137-1-2The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which
EN 62137-1-3This description is for standard: EN 62137-1-3The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land pattern
EN 62137-1-4This description is for standard: EN 62137-1-4The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. Thi
EN 62137-1-5This description is for standard: EN 62137-1-5IEC 62137-1-5:2009 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints