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Homepage>IEC Standards>IEC 60191-6-3:2000 - Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
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download between 0-24 hoursReleased: 2000-09-29
IEC 60191-6-3:2000 - Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

IEC 60191-6-3:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-3: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Méthodes de mesure pour les boîtiers plats quadrangulaires (QFP)

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Standard number:IEC 60191-6-3:2000
Released:2000-09-29
Language:English/French - Bilingual
DESCRIPTION

IEC 60191-6-3:2000

IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.