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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>20/30409140 DC BS IEC 61189-2-807. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA
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20/30409140 DC BS IEC 61189-2-807. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA

20/30409140 DC

BS IEC 61189-2-807. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA

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Standard number:20/30409140 DC
Pages:10
Released:2020-04-22
Status:Draft for Comment
DESCRIPTION

20/30409140 DC


This standard 20/30409140 DC BS IEC 61189-2-807. Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
  • 35.100.01 Open systems interconnection in general
  • 31.180 Printed circuits and boards

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