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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>20/30427157 DC BS IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-808. Thermal resistance of dielectric layer by thermal transient method
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20/30427157 DC BS IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-808. Thermal resistance of dielectric layer by thermal transient method

20/30427157 DC

BS IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-808. Thermal resistance of dielectric layer by thermal transient method

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Standard number:20/30427157 DC
Pages:17
Released:2020-12-08
Status:Draft for Comment
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20/30427157 DC


This standard 20/30427157 DC BS IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
  • 35.100.01 Open systems interconnection in general