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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>21/30446636 DC BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method
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21/30446636 DC BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method

21/30446636 DC

BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method

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Standard number:21/30446636 DC
Pages:18
Released:2021-10-29
Status:Draft for Comment
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21/30446636 DC


This standard 21/30446636 DC BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
  • 35.100.01 Open systems interconnection in general
  • 31.180 Printed circuits and boards