Log inSign up
LANGUAGE en
Menu
STOREABOUT US Help centerContactsDelivery chargesNews
SEARCH
0
Total price
0 USD
PRICES include / exclude VAT
Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>21/30446636 DC BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method
Sponsored link
immediate downloadReleased: 2021-10-29
21/30446636 DC BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method

21/30446636 DC

BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-808. Thermal resistance of an assembly by thermal transient method

Format
Availability
Price and currency
English Secure PDF
Immediate download
26.00 USD
English Hardcopy
In stock
26.00 USD
Standard number:21/30446636 DC
Pages:18
Released:2021-10-29
Status:Draft for Comment
DESCRIPTION

21/30446636 DC


This standard 21/30446636 DC BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
  • 35.100.01 Open systems interconnection in general
  • 31.180 Printed circuits and boards

Print