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Homepage>ASTM Standards>31>31.020>ASTM F3147-15 - Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend
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Released: 01.06.2015

ASTM F3147-15 - Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend

Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend

CURRENCY
51.36 USD
Standard number:F3147-15
Released:01.06.2015
Status:Active
Pages:3
Section:10.04
Keywords:bend; conductive adhesive; encapsulant; land-pad; mandrel; printed flexible circuit; SMD; staking compound;
DESCRIPTION

1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility

1.2 A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).

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