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Homepage>BS Standards>25 MANUFACTURING ENGINEERING>25.040 Industrial automation systems>25.040.40 Industrial process measurement and control>BS EN 60191-6-21:2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
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immediate downloadReleased: 2010-12-31
BS EN 60191-6-21:2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

BS EN 60191-6-21:2010

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

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Standard number:BS EN 60191-6-21:2010
Pages:18
Released:2010-12-31
ISBN:978 0 580 64567 9
Status:Standard
DESCRIPTION

BS EN 60191-6-21:2010


This standard BS EN 60191-6-21:2010 Mechanical standardization of semiconductor devices is classified in these ICS categories:
  • 35.100.05 Multilayer applications
  • 35.110 Networking
  • 25.040.40 Industrial process measurement and control
  • 31.080.01 Semiconductor devices in general

This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.