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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
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immediate downloadReleased: 2016-04-30
BS EN 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

BS EN 61189-3-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

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Standard number:BS EN 61189-3-719:2016
Pages:18
Released:2016-04-30
ISBN:978 0 580 85142 1
Status:Standard
DESCRIPTION

BS EN 61189-3-719:2016


This standard BS EN 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards

This part of IEC 61189 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.


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