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immediate downloadReleased: 2019-07-12
BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
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| Standard number: | BS EN IEC 61188-6-4:2019 |
| Pages: | 46 |
| Released: | 2019-07-12 |
| ISBN: | 978 0 580 96642 2 |
| Status: | Standard |
DESCRIPTION
BS EN IEC 61188-6-4:2019
This standard BS EN IEC 61188-6-4:2019 Printed boards and printed board assemblies. Design and use is classified in these ICS categories:
- 31.190 Electronic component assemblies
- 31.180 Printed circuits and boards
This part of IEC 61188 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series.
This document is applicable to the SMD of semiconductor devices and electrical components.