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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61189-2-630:2018 Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning
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immediate downloadReleased: 2018-10-10
BS EN IEC 61189-2-630:2018 Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning

BS EN IEC 61189-2-630:2018

Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning

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Standard number:BS EN IEC 61189-2-630:2018
Pages:14
Released:2018-10-10
ISBN:978 0 580 97309 3
Status:Standard
DESCRIPTION

BS EN IEC 61189-2-630:2018


This standard BS EN IEC 61189-2-630:2018 Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards

This document specifies a test method to determine the amount of water absorbed by metalclad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h


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