PRICES include / exclude VAT

Homepage>BS Standards>19 TESTING>19.080 Electrical and electronic testing>BS EN IEC 61189-5-601:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

BS EN IEC 61189-5-601:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

English Secure PDF

Immediate download

358.80 USD

You can read the standard for 1 hour. More information in the category: E-reading

Reading the standard

for 1 hour

35.88 USD

You can read the standard for 24 hours. More information in the category: E-reading

Reading the standard

for 24 hours

107.64 USD

English Hardcopy

In stock

358.80 USD

Standard number:	BS EN IEC 61189-5-601:2021
Pages:	46
Released:	2021-03-19
ISBN:	978 0 580 96584 5
Status:	Standard

DESCRIPTION

BS EN IEC 61189-5-601:2021

This standard BS EN IEC 61189-5-601:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:

31.180 Printed circuits and boards
19.080 Electrical and electronic testing

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys. The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts). The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.

Print RECOMMEND