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Homepage>BS Standards>33 TELECOMMUNICATIONS. AUDIO AND VIDEO ENGINEERING>33.180 Fibre optic communications>33.180.01 Fibre optic systems in general>BS EN IEC 62148-21:2021 Fibre optic active components and devices. Package and interface standards Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
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immediate downloadReleased: 2021-06-15
BS EN IEC 62148-21:2021 Fibre optic active components and devices. Package and interface standards Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

BS EN IEC 62148-21:2021

Fibre optic active components and devices. Package and interface standards Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

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Standard number:BS EN IEC 62148-21:2021
Pages:20
Released:2021-06-15
ISBN:978 0 539 13576 3
Status:Standard
DESCRIPTION

BS EN IEC 62148-21:2021


This standard BS EN IEC 62148-21:2021 Fibre optic active components and devices. Package and interface standards is classified in these ICS categories:
  • 33.180.01 Fibre optic systems in general
  • 33.180.20 Fibre optic interconnecting devices
IEC 62148-21:2021 is available as IEC 62148-21:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 62148-21: 2021 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. This second edition cancels and replaces the first edition published in 2019. This edition constitutes a technical revision. This edition includes the following significant technical change with respect to the previous edition: specification of an electric guard band area around the optical terminal area, so as to allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).