BS IEC 61189-2-804:2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for time to delamination. T260, T288, T300
| Standard number: | BS IEC 61189-2-804:2023 |
| Pages: | 12 |
| Released: | 2023-08-30 |
| ISBN: | 978 0 539 01307 8 |
| Status: | Standard |
BS IEC 61189-2-804:2023 - The Ultimate Guide for Testing Electrical Materials, Printed Boards, and Other Interconnection Structures and Assemblies
Introducing the BS IEC 61189-2-804:2023, a comprehensive standard that provides detailed test methods for electrical materials, printed boards, and other interconnection structures and assemblies. This standard is specifically designed to measure the time to delamination under various temperature conditions such as T260, T288, and T300.
Released on 30th August 2023, this standard is the latest in the industry, ensuring you have the most up-to-date and accurate methods for testing your electrical materials and assemblies. With a total of 12 pages, this standard provides a concise yet comprehensive guide to ensure the quality and reliability of your products.
Why Choose BS IEC 61189-2-804:2023?
The BS IEC 61189-2-804:2023 is a must-have for any professional in the electrical industry. It provides a clear and detailed methodology for testing the time to delamination of electrical materials, printed boards, and other interconnection structures and assemblies. This ensures that your products are of the highest quality and can withstand the rigors of use in various environments.
Furthermore, this standard is recognized globally, ensuring that your products meet the highest international standards. This not only enhances the reputation of your products but also increases their marketability globally.
Key Features of BS IEC 61189-2-804:2023
The BS IEC 61189-2-804:2023 comes with several key features that make it a valuable resource for professionals in the electrical industry:
- Comprehensive Testing Methods: This standard provides detailed methods for testing the time to delamination of electrical materials, printed boards, and other interconnection structures and assemblies under various temperature conditions.
- Up-to-Date Information: Released in 2023, this standard ensures that you have the most recent and accurate information for testing your products.
- Global Recognition: As a BS IEC standard, this guide is recognized globally, ensuring that your products meet the highest international standards.
- Concise Yet Detailed: With 12 pages, this standard provides a concise yet comprehensive guide to testing your products, saving you time and effort.
Get Your Copy of BS IEC 61189-2-804:2023 Today!
Don't compromise on the quality and reliability of your products. Get your copy of the BS IEC 61189-2-804:2023 today and ensure that your electrical materials, printed boards, and other interconnection structures and assemblies meet the highest international standards. With its ISBN number 978 0 539 01307 8, you can easily find and purchase this standard from any reputable book retailer or directly from the IEC website.
Invest in the BS IEC 61189-2-804:2023 and take your product testing to the next level!
BS IEC 61189-2-804:2023
This standard BS IEC 61189-2-804:2023 Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
- 31.180 Printed circuits and boards