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Homepage>BS Standards>01 GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION>01.100 Technical drawings>01.100.25 Electrical and electronics engineering drawings

01.100.25 Electrical and electronics engineering drawings

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13 results
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13/30290470 DC
BS EN 60191-2/F71. Proposed new package outline. P-ZMP-P89
Released: 2013-09-11
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25.55 USD
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25.55 USD
BS EN 60139:2001
Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
Released: 2001-08-15
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296.45 USD
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296.45 USD
BS EN 60191-3:2000
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of integrated circuits
Released: 2000-06-15
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352.66 USD
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BS EN 60191-6-12:2011
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
Released: 2011-08-31
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253.00 USD
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BS EN 60191-6-17:2011
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Released: 2011-06-30
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253.00 USD
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BS EN 60191-6-1:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals
Released: 2002-03-29
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153.34 USD
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BS EN 60191-6-2:2002
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Released: 2003-03-04
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153.34 USD
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BS EN 60191-6-3:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)
Released: 2001-05-15
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181.45 USD
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BS EN 60191-6-5:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine-pitchball grid array (FBGA)
Released: 2001-11-15
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153.34 USD
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153.34 USD
BS EN 60191-6-6:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine pitch land grid array (FLGA)
Released: 2001-09-05
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181.45 USD
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181.45 USD
BS EN 60191-6-8:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for glass sealed ceramic quad flatpack (G-QFP)
Released: 2001-11-16
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153.34 USD
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BS EN 60848:2013
GRAFCET specification language for sequential function charts
Released: 2013-07-31
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352.66 USD
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352.66 USD
13 results
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