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BS IEC 62047-31:2019
Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Released: 2019-04-17
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181.45 USD
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181.45 USD
BS IEC 62047-32:2019
Semiconductor devices. Micro-electromechanical devices Test method for the nonlinear vibration of MEMS resonators
Semiconductor devices. Micro-electromechanical devices Test method for the nonlinear vibration of MEMS resonators
Released: 2019-01-29
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181.45 USD
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181.45 USD
BS IEC 62047-33:2019
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Released: 2019-04-18
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253.00 USD
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253.00 USD
BS IEC 62047-34:2019
Semiconductor devices. Micro-electromechanical devices Test methods for MEMS piezoresistive pressure-sensitive device on wafer
Semiconductor devices. Micro-electromechanical devices Test methods for MEMS piezoresistive pressure-sensitive device on wafer
Released: 2019-04-16
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181.45 USD
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181.45 USD
English Secure PDF
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253.00 USD
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253.00 USD
BS IEC 62047-36:2019
Semiconductor devices. Micro-electromechanical devices Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
Semiconductor devices. Micro-electromechanical devices Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
Released: 2019-04-24
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181.45 USD
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181.45 USD
BS IEC 62047-37:2020
Semiconductor devices. Micro-electromechanical devices Environmental test methods of MEMS piezoelectric thin films for sensor application
Semiconductor devices. Micro-electromechanical devices Environmental test methods of MEMS piezoelectric thin films for sensor application
Released: 2023-04-05
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181.45 USD
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181.45 USD
BS IEC 62047-38:2021
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Released: 2021-07-07
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181.45 USD
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BS IEC 62047-40:2021
Semiconductor devices. Micro-electromechanical devices Test methods of micro-electromechanical inertial shock switch threshold
Semiconductor devices. Micro-electromechanical devices Test methods of micro-electromechanical inertial shock switch threshold
Released: 2021-09-14
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153.34 USD
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153.34 USD
BS IEC 62047-41:2021
Semiconductor devices. Micro-electromechanical devices RF MEMS circulators and isolators
Semiconductor devices. Micro-electromechanical devices RF MEMS circulators and isolators
Released: 2021-06-28
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296.45 USD
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296.45 USD
BS IEC 62047-42:2022
Semiconductor devices. Micro-electromechanical devices Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
Semiconductor devices. Micro-electromechanical devices Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
Released: 2022-10-24
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253.00 USD
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BS IEC 62830-1:2017
Semiconductor devices. Semiconductor devices for energy harvesting and generation Vibration based piezoelectric energy harvesting
Semiconductor devices. Semiconductor devices for energy harvesting and generation Vibration based piezoelectric energy harvesting
Released: 2020-07-21
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253.00 USD
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253.00 USD