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31.180 Printed circuits and boards

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Released: 2010-11-30
DD IEC/PAS 62326-14:2010
Printed boards Device embedded substrate. Terminology / reliability / design guide
LANGUAGE
English
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Released: 2007-06-29
DD IEC/PAS 62326-7-1:2007
Performance guide for single- and double-sided flexible printed wiring boards
LANGUAGE
English
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Released: 2021-01-22
PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
LANGUAGE
English
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Released: 2019-07-18
PD IEC TR 61189-5-506:2019
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
LANGUAGE
English
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Released: 2020-03-23
PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
LANGUAGE
English
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Released: 2019-04-01
PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
LANGUAGE
English
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Released: 2014-10-31
PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
LANGUAGE
English
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Released: 2014-06-30
PD IEC/PAS 61249-8-1:2014
Qualification and performance of electrical insulating compound for printed wiring assemblies
LANGUAGE
English
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Released: 2014-06-30
PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials
LANGUAGE
English
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Released: 2017-03-31
PD IEC/TR 61189-3-914:2017
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
LANGUAGE
English
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Released: 2014-05-07
PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
LANGUAGE
English
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Released: 2015-12-31
PD IEC/TR 62878-2-2:2015
Device embedded substrate Guidelines. Electrical testing
LANGUAGE
English