31.180 Printed circuits and boards

Performance guide for single- and double-sided flexible printed wiring boards

Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library

Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

Printed board assemblies Technical cleanliness of components and printed board assemblies

Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices

Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards

Generic requirements for printed board assembly products manufacturing description data and transfer methodology

Qualification and performance of electrical insulating compound for printed wiring assemblies

Qualification and performance specification of permanent solder mask and flexible cover materials

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines

Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

Device embedded substrate Guidelines. Electrical testing