31.180 Printed circuits and boards

BS EN IEC 63203-201-2. Wearable electronic devices and technologies Part 201-2. Electronic Textile. Measurement methods for basic properties of conductive fabric and insulation materials

BS EN IEC 62878-2-601. Device Embedding assembly technology Part 2-602. Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

BS EN IEC 63203-402-2 ED1. Wearable electronic devices and technologies Part 402-2. Performance Measurement of Fitness Wearables. Step Counting

BS EN IEC 62899-202-9. Materials. Guidelines for printed patterns for mechanical test

BS EN IEC 61189-2-501. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-501. Test methods for materials for interconnection structures. Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

BS IEC 61189-2-807. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA

BS EN IEC 63203-406-1. Wearable electronic devices and technologies Part 406-1. Test method for measuring contact surface temperature of wrist worn wearable electronic devices

BS IEC 63203-801-1. Wearable electronic devices and technologies Part 801-1. Smart Body Area Network (SmartBAN). Enhanced Ultra-Low Power Physical Layer

BS EN 63203-801-2. Wearable electronic devices and technologies Part 801-2. Smart Body Area Network (SmartBAN). Low Complexity Medium Access Control (MAC) for SmartBAN

BS EN IEC 61189-2-805. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-805. X/Y CTE Test for Thin Base Materials by TMA

BS EN IEC 61189-5-301. Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-301. Test methods for printed board assemblies. Soldering paste using fine solder particles

BS EN IEC 62496-2-61. Optical circuit boards. Basic test and measurement procedures Part 2-61. Test methods. Flexibility for flexible optic-electric circuits