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31.180 Printed circuits and boards

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immediate download
Released: 2001-12-17
BS 123800-003:2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
LANGUAGE
English
immediate download
Released: 2001-12-17
BS 123800:2001
System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
LANGUAGE
English
immediate download
Released: 1990-02-28
BS 4584-103.2:1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials
LANGUAGE
English
immediate download
Released: 1990-02-28
BS 6221-1:1990
Printed wiring boards Guide for the specification writer
LANGUAGE
English
immediate download
Released: 1982-01-29
BS 6221-6:1982
Printed wiring boards Specification for multilayer printed wiring boards
LANGUAGE
English
immediate download
Released: 1994-02-15
BS CECC 123400-003:1994
Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
LANGUAGE
English
immediate download
Released: 1994-02-15
BS CECC 123500-003:1994
Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
LANGUAGE
English
immediate download
Released: 1998-08-15
BS CECC 200025:1998
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
LANGUAGE
English
immediate download
Released: 1996-04-15
BS CECC 23100-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes
LANGUAGE
English
immediate download
Released: 1998-06-15
BS CECC 23100-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plain holes
LANGUAGE
English
immediate download
Released: 1996-04-15
BS CECC 23200-003:1996
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes
LANGUAGE
English
immediate download
Released: 1998-06-15
BS CECC 23200-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plated through holes
LANGUAGE
English