31.190 Electronic component assemblies
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Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
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Released: 2021-04-07
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
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Released: 2021-03-19
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
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Released: 2019-07-12
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
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Released: 2020-02-27
Tracked Changes. Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
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Released: 2018-03-28
Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
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Released: 2020-02-27
Tracked Changes. Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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Released: 2018-11-13
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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Released: 2021-03-18
Surface mounting technology Standard method for the specification of components for through-hole reflow (THR) soldering
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Released: 2019-12-17
Device embedding assembly technology Generic specification for device embedded substrates
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Released: 2019-11-18
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
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Released: 2008-10-31
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
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Released: 2021-01-22
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library