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31.190 Electronic component assemblies
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Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
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270.40 USD
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270.40 USD
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358.80 USD
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358.80 USD
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468.00 USD
English Hardcopy
In stock
468.00 USD
English Secure PDF
Immediate download
358.80 USD
English Hardcopy
In stock
358.80 USD
English Secure PDF
Immediate download
468.00 USD
English Hardcopy
In stock
468.00 USD
English Secure PDF
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358.80 USD
English Hardcopy
In stock
358.80 USD
BS EN IEC 61760-3:2021
Surface mounting technology Standard method for the specification of components for through-hole reflow (THR) soldering
Surface mounting technology Standard method for the specification of components for through-hole reflow (THR) soldering
Released: 2021-03-18
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317.20 USD
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317.20 USD
BS EN IEC 62435-9:2021
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Electronic components. Long-term storage of electronic semiconductor devices Special cases
Released: 2021-10-11
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195.00 USD
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195.00 USD
BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Device embedding assembly technology Generic specification for device embedded substrates
Released: 2019-12-17
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270.40 USD
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270.40 USD
BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Released: 2019-11-18
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377.00 USD
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377.00 USD
BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
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195.00 USD
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195.00 USD
BS EN IEC 63215-2:2023
Endurance test methods for die attach materials Temperature cycling test method for die attach materials applied to discrete type power electronic devices
Endurance test methods for die attach materials Temperature cycling test method for die attach materials applied to discrete type power electronic devices
Released: 2023-12-05
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270.40 USD
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270.40 USD