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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN 61189-3-719 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
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CSN EN 61189-3-719 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

CSN EN 61189-3-719

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

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English Hardcopy
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45.88 USD
Category:359039
Released:2016
Number of Standard:CSN EN 61189-3-719
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EN 61189-3-719


EN 61189-3-719 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling - IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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