CSN EN ISO 9455-14

CSN EN ISO 9455-14 This document specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.