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Homepage>IEC Standards>IEC 61189-2-721:2015 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
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download between 0-24 hoursReleased: 2015-04-29
IEC 61189-2-721:2015 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures -  Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator

IEC 61189-2-721:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator

Methodes d'essai pour les matériaux éléctriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-721: Méthodes d'essai des matériaux pour structures d'interconnexion - Mesure de la permittivité relative et de la tangente de perte pour les stratifiés recouverts de cuivre en hyperfréquences à l'aide d'un résonateur diélectrique en anneaux fendus

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English/French - Bilingual
Standard number:IEC 61189-2-721:2015
Released:2015-04-29
Language:English/French - Bilingual
DESCRIPTION

IEC 61189-2-721:2015

IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.

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