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Homepage>IEC Standards>IEC 62769-103-4:2020 RLV - Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET
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download between 0-24 hoursReleased: 2020-04-28
IEC 62769-103-4:2020 RLV - Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET

IEC 62769-103-4:2020 RLV

Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET

CURRENCY
349.56 USD
Standard number:IEC 62769-103-4:2020 RLV
Released:2020-04-28
Language:English
DESCRIPTION

IEC 62769-103-4:2020 RLV

IEC 62769-103-4:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62769-103-4:2020 specifies an FDI profile of IEC 62769 for IEC 61784-2_CP 3/4, IEC 61784-2_CP3/5 and IEC 61784-2_CP3/6 (PROFINET). This second edition cancels and replaces the first edition published in 2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) support for generic protocol extension for faster adoption of other technologies; b) support for Package Developers to build EDDs targeted for today’s EDD bases system under a single development tool.