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Homepage>BS Standards>19 TESTING>19.040 Environmental testing>PD IEC/TR 60068-3-12:2014 Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
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immediate downloadReleased: 2014-10-17
PD IEC/TR 60068-3-12:2014 Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile

PD IEC/TR 60068-3-12:2014

Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile

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Standard number:PD IEC/TR 60068-3-12:2014
Pages:20
Released:2014-10-17
ISBN:978 0 580 85604 4
Status:Standard
DESCRIPTION

PD IEC/TR 60068-3-12:2014


This standard PD IEC/TR 60068-3-12:2014 Environmental testing is classified in these ICS categories:
  • 19.040 Environmental testing

This part of IEC 60068 , which is a technical report, presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste.

This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components).

Study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances.

Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes.