PRICES include / exclude VAT
Homepage>BS Standards>17 METROLOGY AND MEASUREMENT. PHYSICAL PHENOMENA>17.220 Electricity. Magnetism. Electrical and magnetic measurements>17.220.99 Other standards related to electricity and magnetism>PD IEC TR 61340-5-5:2018 Electrostatics Protection of electronic devices from electrostatic phenomena. Packaging systems used in electronic manufacturing
Sponsored link
immediate downloadReleased: 2018-12-06
PD IEC TR 61340-5-5:2018 Electrostatics Protection of electronic devices from electrostatic phenomena. Packaging systems used in electronic manufacturing

PD IEC TR 61340-5-5:2018

Electrostatics Protection of electronic devices from electrostatic phenomena. Packaging systems used in electronic manufacturing

Format
Availability
Price and currency
English Secure PDF
Immediate download
317.20 USD
English Hardcopy
In stock
317.20 USD
Standard number:PD IEC TR 61340-5-5:2018
Pages:38
Released:2018-12-06
ISBN:978 0 539 00576 9
Status:Standard
DESCRIPTION

PD IEC TR 61340-5-5:2018


This standard PD IEC TR 61340-5-5:2018 Electrostatics is classified in these ICS categories:
  • 29.020 Electrical engineering in general
  • 17.220.99 Other standards related to electricity and magnetism

This part of IEC 61340 discusses packaging material requirements for electrostatic discharge sensitive items (ESDS) as well as non–ESDS which can apply to packaging materials such as embossed carrier tape, trays, tubes (stick magazines), rails and others used in back end line processing and parts handling where test methods described in other standards are, for the most part, inadequate. Issues related to electrostatic charge generation, electrostatic attraction and repulsion are included. The recommendations and discussions within this document can also be applicable to other types of packaging that cannot be evaluated by other means.

This document discusses the issues related to

  1. technical considerations for packaging material selection and packaging system design,

  2. packaging material specifications for electrostatic control,

  3. existing test methods and their limitations for packaging materials,

  4. suggestions for the evaluation of small dimension packaging materials, and

  5. industry common practices.