Log inSign up
LANGUAGE en
Menu
STOREABOUT US Help centerContactsDelivery chargesNews
SEARCH
0
Total price
0 USD
PRICES include / exclude VAT
Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies
Sponsored link
immediate downloadReleased: 2015-04-30
BS EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies

BS EN 61189-5-2:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies

Format
Availability
Price and currency
English Secure PDF
Immediate download
358.80 USD
English Hardcopy
In stock
358.80 USD
Standard number:BS EN 61189-5-2:2015
Pages:46
Released:2015-04-30
ISBN:978 0 580 90018 1
Status:Corrigendum
DESCRIPTION

BS EN 61189-5-2:2015


This standard BS EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

This part of IEC 61189 focuses on test methods for soldering flux based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering flux for lead free soldering.


Print