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Homepage>IEC Standards>IEC 60191-6-18:2010/COR2:2010 - Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
download between 0-24 hoursReleased: 2010-07-28
IEC 60191-6-18:2010/COR2:2010 - Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

IEC 60191-6-18:2010/COR2:2010

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Corrigendum 2 - Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-18: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers matriciels à billes (BGA)

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Standard number:IEC 60191-6-18:2010/COR2:2010
Released:2010-07-28
Edition:1
ICS:31.080.01
Pages (English/French - Bilingual):1
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IEC 60191-6-18:2010/COR2:2010

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