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>IEC Standards>IEC 62878-1:2019 - Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
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immediate downloadReleased: 2019-10-14
IEC 62878-1:2019 - Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

IEC 62878-1:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

Techniques d’assemblage avec appareils intégrés - Partie 1: Spécification générique pour substrats avec appareils intégrés

CURRENCY
124.2 EUR
Standard number:IEC 62878-1:2019
Released:2019-10-14
Language:English/French - Bilingual
DESCRIPTION

IEC 62878-1:2019

IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components. The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

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