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IEC 62459:2010/COR1:2015
Corrigendum 1 - Sound system equipment - Electroacoustical transducers - Measurement of suspension parts
Corrigendum 1 - Sound system equipment - Electroacoustical transducers - Measurement of suspension parts
Released: 2015-11-20
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IEC 61284:1997/COR1:1998
Corrigendum 1 - Overhead lines - Requirements and tests for fittings
Corrigendum 1 - Overhead lines - Requirements and tests for fittings
Released: 1998-09-30
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IEC 61056-2:2012/COR1:2012
Corrigendum 1 - General purpose lead-acid batteries (valve-regulated types) - Part 2: Dimensions, terminals and marking
Corrigendum 1 - General purpose lead-acid batteries (valve-regulated types) - Part 2: Dimensions, terminals and marking
Released: 2012-10-30
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IEC 62485-5:2020/COR1:2022
Corrigendum 1 - Safety requirements for secondary batteries and battery installations - Part 5: Safe operation of stationary lithium ion batteries
Corrigendum 1 - Safety requirements for secondary batteries and battery installations - Part 5: Safe operation of stationary lithium ion batteries
Released: 2022-06-03
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IEC 60315-6:1991/COR1:1997
Corrigendum 1 - Methods of measurement on radio receivers for various classes of emission - Part 6: General purpose communication receivers
Corrigendum 1 - Methods of measurement on radio receivers for various classes of emission - Part 6: General purpose communication receivers
Released: 1997-02-28
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IEC 60454-2:2007/COR1:2009
Corrigendum 1 - Pressure-sensitive adhesive tapes for electrical purposes - Part 2: Methods of test
Corrigendum 1 - Pressure-sensitive adhesive tapes for electrical purposes - Part 2: Methods of test
Released: 2009-12-17
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IEC 60601-1:2005/AMD1:2012/COR1:2014
Corrigendum 1 - Amendment 1 - Medical electrical equipment - Part 1: General requirements for basic safety and essential performance
Corrigendum 1 - Amendment 1 - Medical electrical equipment - Part 1: General requirements for basic safety and essential performance
Released: 2014-07-22
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IEC 60749-22:2002/COR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Released: 2003-08-13
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IEC 60749-8:2002/COR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Released: 2003-04-23
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