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Main page>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards>24/30488910 DC BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
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immediate downloadReleased: 2024-03-11
24/30488910 DC BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

24/30488910 DC

BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

CURRENCY
26.35 USD
Standard number:24/30488910 DC
Pages:18
Released:2024-03-11
Status:Draft for Comment
DESCRIPTION

24/30488910 DC


This standard 24/30488910 DC BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards

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