>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards>24/30488910 DC BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
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immediate downloadReleased: 2024-03-11
24/30488910 DC
BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
CURRENCY
Standard number:
24/30488910 DC
Pages:
18
Released:
2024-03-11
Status:
Draft for Comment
DESCRIPTION
24/30488910 DC
This standard 24/30488910 DC BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
