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Homepage>BSI Standards >31 ELECTRONICS>31.190 Electronic component assemblies>25/30510987 DC Draft BS EN 61249-2-55 Materials for printed boards and other interconnecting structures Part 2-55. Reinforced base materials clad and unclad. Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad
immediate downloadReleased: 2025-07-21
25/30510987 DC Draft BS EN 61249-2-55 Materials for printed boards and other interconnecting structures Part 2-55. Reinforced base materials clad and unclad. Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad

25/30510987 DC

Draft BS EN 61249-2-55 Materials for printed boards and other interconnecting structures Part 2-55. Reinforced base materials clad and unclad. Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad

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23.20 EUR
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23.20 EUR
Standard number:25/30510987 DC
Pages:25
Released:2025-07-21
Status:Draft for Comment
Pages (English):25
DESCRIPTION

25/30510987 DC


This standard 25/30510987 DC Draft BS EN 61249-2-55 Materials for printed boards and other interconnecting structures is classified in these ICS categories:
  • 31.190 Electronic component assemblies

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