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>BSI Standards >31 ELECTRONICS>31.190 Electronic component assemblies>25/30511568 DC Draft BS EN 63609-1 Measurement method used in thermal design for electronics assemblies Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant
immediate downloadReleased: 2025-11-13
25/30511568 DC Draft BS EN 63609-1 Measurement method used in thermal design for electronics assemblies Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant

25/30511568 DC

Draft BS EN 63609-1 Measurement method used in thermal design for electronics assemblies Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant

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Standard number:25/30511568 DC
Pages:22
Released:2025-11-13
Status:Draft for Comment
DESCRIPTION

25/30511568 DC


This standard 25/30511568 DC Draft BS EN 63609-1 Measurement method used in thermal design for electronics assemblies is classified in these ICS categories:
  • 31.190 Electronic component assemblies

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