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>BSI Standards >31 ELECTRONICS>31.190 Electronic component assemblies>25/30511572 DC Draft BS EN 63609-2 Measurement method used in thermal design for electronics assemblies Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites
immediate downloadReleased: 2025-11-11
25/30511572 DC Draft BS EN 63609-2 Measurement method used in thermal design for electronics assemblies Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites

25/30511572 DC

Draft BS EN 63609-2 Measurement method used in thermal design for electronics assemblies Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites

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Standard number:25/30511572 DC
Pages:29
Released:2025-11-11
Status:Draft for Comment
DESCRIPTION

25/30511572 DC


This standard 25/30511572 DC Draft BS EN 63609-2 Measurement method used in thermal design for electronics assemblies is classified in these ICS categories:
  • 31.190 Electronic component assemblies

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