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>ASTM Standards>ASTM D3004-08R20 - Standard Specification for Crosslinked and Thermoplastic Extruded Semi-Conducting, Conductor, and Insulation Shielding Materials
Released: 01.08.2020

ASTM D3004-08R20

Standard Specification for Crosslinked and Thermoplastic Extruded Semi-Conducting, Conductor, and Insulation Shielding Materials

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Standard number:ASTM D3004-08R20
Released:01.08.2020
Status:Active
Pages:2
Section:10.02
Keywords:conductor shielding material; insulation shielding material; semicon; semi-conducting shielding material; volume resistivity;
ASTM number:ASTM D3004
Supersedes:D3004-08R13

This specification covers extruded cross linked and thermoplastic semi-conducting, conductor and insulation shielding materials for electrical wires and cables. The materials covered are not compatible with hydro carbon derivatives of a swelling or deteriorating nature. Different tests shall be performed in order to determine physical properties like brittleness, aging requirements, and elongation at rupture and volume resistivity.

DESCRIPTION

1.1 This specification covers crosslinked and thermoplastic extruded semi-conducting, conductor, and insulation shielding materials for electrical wires and cables.

1.2 In many instances, the electrical properties of the shielding material are strongly dependent on processing conditions. For this reason, in this specification the material is sampled from cable. Therefore, tests are done on shielded wire in this standard solely to determine the relevant property of the shielding material and not to test the conductor or completed cable.

1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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