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>BSI Standards >77 METALLURGY>77.040 Testing of metals>77.040.99 Other methods of testing of metals>BS 5909:1980 Method for scale adhesion test for oxygen-free copper
immediate downloadReleased: 1980-04-30
BS 5909:1980 Method for scale adhesion test for oxygen-free copper

BS 5909:1980

Method for scale adhesion test for oxygen-free copper

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Standard number:BS 5909:1980
Pages:6
Released:1980-04-30
ISBN:0 580 11265 9
Status:Standard
DESCRIPTION

BS 5909:1980


This standard BS 5909:1980 Method for scale adhesion test for oxygen-free copper is classified in these ICS categories:
  • 77.040.99 Other methods of testing of metals

This International Standard specifies a procedure for the scale adhesion testing of oxygen-free high-conductivity copper.


Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.
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