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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards>BS CECC 23600-801:1998 Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
immediate downloadReleased: 1998-06-15
BS CECC 23600-801:1998 Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections

BS CECC 23600-801:1998

Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections

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English Secure PDF
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Printable - You are authorized to print 1 copy
246.40 EUR
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246.40 EUR
Standard number:BS CECC 23600-801:1998
Pages:24
Released:1998-06-15
ISBN:0 580 29890 6
Status:Standard
DESCRIPTION

BS CECC 23600-801:1998


This standard BS CECC 23600-801:1998 Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections is classified in these ICS categories:
  • 31.180 Printed circuits and boards

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