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>BSI Standards >01 GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION>01.100 Technical drawings>01.100.25 Electrical and electronics engineering drawings>BS EN 60191-6-1:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals
immediate downloadReleased: 2002-03-29
BS EN 60191-6-1:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals

BS EN 60191-6-1:2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals

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Standard number:BS EN 60191-6-1:2001
Pages:12
Released:2002-03-29
ISBN:0 580 39236 8
Status:Standard
DESCRIPTION

BS EN 60191-6-1:2001


This standard BS EN 60191-6-1:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages is classified in these ICS categories:
  • 01.100.25 Electrical and electronics engineering drawings
  • 31.080.01 Semiconductor devices in general
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
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