BS EN 61188-5-2:2003

This standard BS EN 61188-5-2:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations is classified in these ICS categories:

• 31.190 Electronic component assemblies
• 31.180 Printed circuits and boards

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.