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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards>BS EN 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
immediate downloadReleased: 2013-07-31
BS EN 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys

BS EN 61189-11:2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys

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Standard number:BS EN 61189-11:2013
Pages:20
Released:2013-07-31
ISBN:978 0 580 68869 0
Status:Standard
DESCRIPTION

BS EN 61189-11:2013


This standard BS EN 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.
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