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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards>BS EN 61189-2-721:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
immediate downloadReleased: 2015-06-30
BS EN 61189-2-721:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

BS EN 61189-2-721:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

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Standard number:BS EN 61189-2-721:2015
Pages:28
Released:2015-06-30
ISBN:978 0 580 83821 7
Status:Standard
DESCRIPTION

BS EN 61189-2-721:2015


This standard BS EN 61189-2-721:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.
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