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>BSI Standards >31 ELECTRONICS>31.190 Electronic component assemblies>BS EN 61190-1-1:2002 Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
immediate downloadReleased: 2002-08-16
BS EN 61190-1-1:2002 Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly

BS EN 61190-1-1:2002

Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly

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Standard number:BS EN 61190-1-1:2002
Pages:26
Released:2002-08-16
ISBN:0 580 40261 4
Status:Standard
DESCRIPTION

BS EN 61190-1-1:2002


This standard BS EN 61190-1-1:2002 Attachment materials for electronic assembly is classified in these ICS categories:
  • 31.190 Electronic component assemblies
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
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