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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards>BS EN 61191-3:2017 - TC Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
immediate downloadReleased: 2020-02-26
BS EN 61191-3:2017 - TC Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies

BS EN 61191-3:2017 - TC

Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies

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Standard number:BS EN 61191-3:2017 - TC
Pages:61
Released:2020-02-26
ISBN:978 0 539 10340 3
Status:Tracked Changes
DESCRIPTION

BS EN 61191-3:2017 - TC


This standard BS EN 61191-3:2017 - TC Tracked Changes. Printed board assemblies is classified in these ICS categories:
  • 31.240 Mechanical structures for electronic equipment
  • 31.180 Printed circuits and boards
IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.


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