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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards>BS EN 61249-2-38:2009 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
immediate downloadReleased: 2009-06-30
BS EN 61249-2-38:2009 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

BS EN 61249-2-38:2009

Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

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Standard number:BS EN 61249-2-38:2009
Pages:28
Released:2009-06-30
ISBN:978 0 580 58820 4
Status:Standard
DESCRIPTION

BS EN 61249-2-38:2009


This standard BS EN 61249-2-38:2009 Materials for printed boards and other interconnecting structures is classified in these ICS categories:
  • 31.180 Printed circuits and boards
IEC 61249-2-38:2008 gives requirements for properties of di-functional non-halogenated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 120 °C minimum.
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