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>BSI Standards >31 ELECTRONICS>31.080 Semiconductor devices>31.080.99 Other semiconductor devices>BS EN 62047-17:2015 Semiconductor devices. Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films
immediate downloadReleased: 2015-07-31
BS EN 62047-17:2015 Semiconductor devices. Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films

BS EN 62047-17:2015

Semiconductor devices. Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films

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Standard number:BS EN 62047-17:2015
Pages:34
Released:2015-07-31
ISBN:978 0 580 72203 5
Status:Standard
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BS EN 62047-17:2015


This standard BS EN 62047-17:2015 Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:
  • 31.080.99 Other semiconductor devices
IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 ? to 10 ?, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm. The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.
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