Don't have a credit card? Never mind we support BANK TRANSFER .

Log inSign up
LANGUAGE en
Menu
STOREHelp centerContactsDelivery chargesABOUT US News
SEARCH
0
Total price
0 EUR
PRICES include / exclude VAT
>BSI Standards >31 ELECTRONICS>31.190 Electronic component assemblies>BS EN 62137-1-1:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
immediate downloadReleased: 2007-10-31
BS EN 62137-1-1:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test

BS EN 62137-1-1:2007

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test

Format
Availability
Price and currency
English Secure PDF
Immediate download
Printable - You are authorized to print 1 copy
176.96 EUR
English Hardcopy
In stock
176.96 EUR
Standard number:BS EN 62137-1-1:2007
Pages:18
Released:2007-10-31
ISBN:978 0 580 55335 6
Status:Standard
DESCRIPTION

BS EN 62137-1-1:2007


This standard BS EN 62137-1-1:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint is classified in these ICS categories:
  • 31.190 Electronic component assemblies
The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
Print