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>BSI Standards >31 ELECTRONICS>31.190 Electronic component assemblies>BS EN 62137-1-3:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
immediate downloadReleased: 2009-03-31
BS EN 62137-1-3:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test

BS EN 62137-1-3:2009

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test

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Standard number:BS EN 62137-1-3:2009
Pages:28
Released:2009-03-31
ISBN:978 0 580 57386 6
Status:Standard
DESCRIPTION

BS EN 62137-1-3:2009


This standard BS EN 62137-1-3:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint is classified in these ICS categories:
  • 31.190 Electronic component assemblies
The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.
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