BS EN IEC 60068-2-83:2025
Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
| Standard number: | BS EN IEC 60068-2-83:2025 |
| Pages: | 42 |
| Released: | 2025-07-29 |
| ISBN: | 978 0 539 28893 3 |
| Status: | Standard |
| Pages (English): | 42 |
| ISBN (English): | 978 0 539 28893 3 |
BS EN IEC 60068-2-83:2025 - Solderability Testing of Electronic Components for SMD
Introducing the BS EN IEC 60068-2-83:2025, a comprehensive standard dedicated to the environmental testing of electronic components, specifically focusing on the solderability of surface mounting devices (SMD) using the wetting balance method with solder paste. This standard is an essential resource for professionals in the electronics industry, ensuring the reliability and quality of electronic components in various applications.
Key Features
- Standard Number: BS EN IEC 60068-2-83:2025
- Pages: 42
- Release Date: July 29, 2025
- ISBN: 978 0 539 28893 3
- Status: Standard
Overview
The BS EN IEC 60068-2-83:2025 standard provides a detailed methodology for testing the solderability of electronic components designed for surface mounting. This is achieved through the wetting balance method, which is a critical process in evaluating the performance and reliability of solder joints. The standard is designed to help manufacturers and quality assurance professionals ensure that their components meet the necessary solderability requirements, thereby enhancing the overall quality and durability of electronic assemblies.
Why Solderability Testing is Important
Solderability testing is a crucial aspect of electronic component manufacturing. It ensures that components can be reliably soldered onto printed circuit boards (PCBs), which is vital for the functionality and longevity of electronic devices. Poor solderability can lead to weak joints, which may result in device failure. By adhering to the BS EN IEC 60068-2-83:2025 standard, manufacturers can mitigate these risks and ensure high-quality production.
Wetting Balance Method
The wetting balance method is a precise technique used to assess the solderability of electronic components. It measures the wetting force as a function of time, providing valuable data on the interaction between the solder paste and the component leads or terminations. This method is particularly effective for surface mounting devices, where the quality of the solder joint is paramount. The BS EN IEC 60068-2-83:2025 standard outlines the procedures and requirements for conducting this test, ensuring consistent and reliable results.
Applications
This standard is applicable to a wide range of industries and sectors, including:
- Consumer Electronics
- Automotive Electronics
- Telecommunications
- Medical Devices
- Aerospace and Defense
In each of these sectors, the reliability of electronic components is critical, and adherence to the BS EN IEC 60068-2-83:2025 standard ensures that components meet the necessary quality standards.
Benefits of Using the Standard
By implementing the guidelines set forth in the BS EN IEC 60068-2-83:2025 standard, organizations can achieve several benefits:
- Improved Reliability: Ensures that components have strong, reliable solder joints.
- Quality Assurance: Provides a benchmark for quality control processes.
- Cost Efficiency: Reduces the risk of component failure and the associated costs of rework or replacement.
- Compliance: Helps organizations meet industry regulations and standards.
Conclusion
The BS EN IEC 60068-2-83:2025 standard is an invaluable tool for any organization involved in the production or use of electronic components. By providing a clear and detailed methodology for solderability testing, it helps ensure the quality and reliability of electronic assemblies. Whether you are a manufacturer, quality assurance professional, or engineer, this standard is essential for maintaining high standards in electronic component production.
BS EN IEC 60068-2-83:2025
This standard BS EN IEC 60068-2-83:2025 Environmental testing is classified in these ICS categories:
- 19.040 Environmental testing
- 31.190 Electronic component assemblies
IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes. NOTE?Different solderability test methods for SMD are described in IEC 60068?2?58 and IEC 60068?2?69. IEC 60068?2?58 specifies visual evaluation using solder bath and reflow method, IEC 60068?2?69 specifies wetting balance evaluation using solder bath and solder globule method. This edition includes the following significant technical change with respect to the previous edition: a) revise Clause 5 to align with that in IEC 60068?2?20:2021.