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>BSI Standards >31 ELECTRONICS>31.020 Electronic components in general>BS EN IEC 60286-3:2022 - TC Tracked Changes. Packaging of components for automatic handling Packaging of surface mount components on continuous tapes
immediate downloadReleased: 2023-01-27
BS EN IEC 60286-3:2022 - TC Tracked Changes. Packaging of components for automatic handling Packaging of surface mount components on continuous tapes

BS EN IEC 60286-3:2022 - TC

Tracked Changes. Packaging of components for automatic handling Packaging of surface mount components on continuous tapes

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Standard number:BS EN IEC 60286-3:2022 - TC
Pages:142
Released:2023-01-27
ISBN:978 0 539 25620 8
Status:Tracked Changes
DESCRIPTION

BS EN IEC 60286-3:2022 - TC


This standard BS EN IEC 60286-3:2022 - TC Tracked Changes. Packaging of components for automatic handling is classified in these ICS categories:
  • 31.020 Electronic components in general
  • 31.240 Mechanical structures for electronic equipment
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
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