BS EN IEC 60749-22-2:2026 Semiconductor Devices Standard

Introducing the BS EN IEC 60749-22-2:2026, a comprehensive standard that sets the benchmark for mechanical and climatic test methods specifically designed for semiconductor devices. This standard focuses on the bond strength and wire bond shear test methods, ensuring that your semiconductor devices meet the highest quality and reliability standards.

Overview

The semiconductor industry is at the heart of modern technology, powering everything from smartphones to advanced computing systems. As such, ensuring the reliability and durability of semiconductor devices is crucial. The BS EN IEC 60749-22-2:2026 standard provides detailed methodologies for testing the mechanical and climatic resilience of these devices, with a particular focus on bond strength and wire bond shear tests.

Key Features

• Standard Number: BS EN IEC 60749-22-2:2026
• Pages: 40
• Release Date: January 21, 2026
• ISBN: 978 0 539 34067 9
• Status: Standard

Why This Standard is Essential

In the fast-paced world of semiconductor technology, maintaining the integrity and performance of devices is paramount. The BS EN IEC 60749-22-2:2026 standard provides a rigorous framework for testing the mechanical and climatic properties of semiconductor devices. By adhering to this standard, manufacturers can ensure that their products are not only compliant with international regulations but also capable of withstanding the demands of real-world applications.

Mechanical and Climatic Test Methods

This standard outlines specific test methods to evaluate the mechanical and climatic durability of semiconductor devices. These tests are designed to simulate the conditions that devices may encounter during their lifecycle, including temperature fluctuations, humidity, and mechanical stress. By conducting these tests, manufacturers can identify potential weaknesses and improve the overall reliability of their products.

Bond Strength and Wire Bond Shear Test Methods

The bond strength and wire bond shear tests are critical components of this standard. These tests assess the strength and integrity of the bonds within semiconductor devices, which are crucial for maintaining electrical connectivity and device performance. The standard provides detailed procedures for conducting these tests, ensuring consistent and accurate results.

Benefits of Compliance

Compliance with the BS EN IEC 60749-22-2:2026 standard offers numerous benefits for manufacturers and end-users alike:

• Enhanced Product Reliability: By following the prescribed test methods, manufacturers can produce semiconductor devices that are more reliable and durable.
• International Recognition: This standard is recognized globally, facilitating easier market access and acceptance of products.
• Quality Assurance: Adhering to this standard demonstrates a commitment to quality and excellence, enhancing brand reputation.
• Risk Mitigation: Identifying potential issues early in the development process helps mitigate risks and reduce the likelihood of product failures.

Who Should Use This Standard?

The BS EN IEC 60749-22-2:2026 standard is essential for a wide range of stakeholders in the semiconductor industry, including:

• Semiconductor Manufacturers: To ensure their products meet international quality and reliability standards.
• Quality Assurance Teams: To implement rigorous testing protocols and maintain high standards of product quality.
• Research and Development Engineers: To design and develop semiconductor devices that are robust and reliable.
• Regulatory Bodies: To establish and enforce compliance with industry standards.

Conclusion

The BS EN IEC 60749-22-2:2026 standard is an indispensable resource for anyone involved in the design, manufacture, and testing of semiconductor devices. By providing detailed methodologies for mechanical and climatic testing, this standard ensures that semiconductor devices are capable of meeting the demands of modern technology. Embrace this standard to enhance the quality, reliability, and marketability of your semiconductor products.

BS EN IEC 60749-22-2:2026

This standard BS EN IEC 60749-22-2:2026 Semiconductor devices — Mechanical and climatic test methods is classified in these ICS categories:

• 29.100.10 Magnetic components
• 31.080.01 Semiconductor devices in general

IEC 60749-22-2:2025 establishes a means for determining the strength of a ball bond to a die or package bonding surface and can be performed on pre-encapsulation or post-encapsulation devices. This measure of bond strength is extremely important in determining two features: a) the integrity of the metallurgical bond which has been formed, and b) the quality of ball bonds to die or package bonding surfaces. This test method covers thermosonic (ball) bonds made with small diameter wire from 15 µm to 76 µm (0,000 6" to 0,003"). This test method can only be used when the bonds are large enough to allow for proper contact with the shear test chisel and when there are no adjacent interfering structures that would hinder the movement of the chisel. For consistent shear results the ball height will be at least 4,0 µm (0,000 6 ") for ball bonds, which is the current state of the art for bond shear test equipment at the time of this revision. This test method can also be used on ball bonds that have had their wire removed and on to which a second bond wire (typically a stitch bond) is placed. This is known as "stitch on ball" and "reverse bonding". See Annex A for additional information. The wire bond shear test is destructive. It is appropriate for use in process development, process control, or quality assurance, or both. This test method can be used on ultrasonic (wedge) bonds, however its use has not been shown to be a consistent indicator of bond integrity. See Annex B for information on performing shear testing on wedge bonds. This test method does not include bond strength testing using wire bond pull testing. Wire bond pull testing is described in IEC 60749-22-1. This first edition, together with the first edition of IEC 60749-22-1, cancels and replaces the first edition IEC 60749-22 published in 2002. This International Standard is to be used in conjunction with IEC 60749-22-1:2025. This edition includes the following significant technical changes with respect to the previous edition: a) Major update, including new techniques and use of new materials (e.g. copper wire) involving a complete rewrite as two separate subparts (this document and IEC 60749‑22‑1).