BS EN IEC 61188-6-3:2025
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for through hole components (THT)
| Standard number: | BS EN IEC 61188-6-3:2025 |
| Pages: | 36 |
| Released: | 2025-02-04 |
| ISBN: | 978 0 539 16377 3 |
| Status: | Standard |
BS EN IEC 61188-6-3:2025 - Circuit Boards and Circuit Board Assemblies
Welcome to the future of circuit board design with the BS EN IEC 61188-6-3:2025 standard. This comprehensive guide is your essential resource for mastering the design and use of land patterns specifically tailored for through hole components (THT). Whether you're an experienced engineer or a newcomer to the field, this standard provides the detailed insights and guidelines you need to excel in your projects.
Overview
The BS EN IEC 61188-6-3:2025 standard is a pivotal document in the realm of electronic design, focusing on the intricacies of land pattern design for through hole components. Released on February 4, 2025, this 36-page standard is a must-have for professionals seeking to ensure precision and reliability in their circuit board assemblies.
Key Features
- Standard Number: BS EN IEC 61188-6-3:2025
- Pages: 36
- Release Date: February 4, 2025
- ISBN: 978 0 539 16377 3
- Status: Standard
Why Choose This Standard?
In the fast-evolving world of electronics, staying ahead of the curve is crucial. The BS EN IEC 61188-6-3:2025 standard equips you with the knowledge to design land patterns that meet the highest industry standards. By adhering to this standard, you ensure that your circuit board assemblies are not only efficient but also reliable and durable.
Comprehensive Guidance
This standard provides a detailed description of land patterns for through hole components, offering guidance on dimensions, tolerances, and layout considerations. It helps you understand the critical aspects of land pattern design, ensuring that your components fit perfectly and function optimally.
Enhanced Reliability
Through hole technology (THT) is renowned for its robustness and reliability, especially in applications where mechanical strength is paramount. The BS EN IEC 61188-6-3:2025 standard ensures that your designs leverage these strengths, resulting in circuit boards that withstand the test of time and environmental challenges.
Industry Compliance
Compliance with industry standards is not just a best practice; it's a necessity. This standard aligns with international guidelines, ensuring that your designs are globally recognized and accepted. By following the BS EN IEC 61188-6-3:2025, you demonstrate your commitment to quality and excellence.
Who Should Use This Standard?
The BS EN IEC 61188-6-3:2025 standard is ideal for:
- Electronic design engineers
- PCB designers
- Quality assurance professionals
- Manufacturers of electronic components
- Technical educators and trainers
Conclusion
Incorporating the BS EN IEC 61188-6-3:2025 standard into your design process is a strategic move towards achieving excellence in circuit board assemblies. With its comprehensive guidelines and focus on through hole components, this standard is an invaluable tool for anyone involved in the design and manufacturing of electronic products.
Embrace the future of electronic design with confidence and precision. Make the BS EN IEC 61188-6-3:2025 standard a cornerstone of your design toolkit and ensure your projects meet the highest standards of quality and reliability.
BS EN IEC 61188-6-3:2025
This standard BS EN IEC 61188-6-3:2025 Circuit boards and circuit board assemblies. Design and use is classified in these ICS categories:
- 31.190 Electronic component assemblies
- 31.180 Printed circuits and boards